Component Testing

GKSEMI cooperates with five electronic component testing centers in Guangzhou, to conduct product quality and reliability testing for VIP clients free of charge.

Appearance testing and IC authenticity identification:
Conduct detailed appearance testing resorting to magnifier or microscope. For the doubtful components which cannot be judged resorting to the appearance, IC can be opened, i.e., the glue sealing outside of IC can be removed through the method of chemical corrosion, to identify the authenticity of Logo, number with 2000/1 high power microscope with video acquisition system while photos are taken.

X-ray testing:
It is one of the non-contact/non-destructive detecting tools in semiconductor industry, which can be used to test the various defects in IC package such as peeling, crack, cavity as well as the integrity of bonding, including abnormal-connection defects of open and short circuit on bonding OR PAD.

Probe testing:
Through utilization of microprobe system, basic electric parameter testing can be made for opened IC, bare chip and Wafer working in with the measuring instruments such as source table, digital oscilloscope, including tests for I-V specification, open and short circuit tests.

DC parameter testing:
Resorting to various testing tools and relevant periphery auxiliary circuits, IC test machine or semiconductor parameter tester can be used to test various DC parameters, for example:
Open and Shorts
Output drive/sink current (IOH,IOL)
Leakage
Power current
Standby current
Threshold levels( VIH,VIL)

IC function verification testing:
According to the description for the relevant functions in truth table timing diagram provided in Datasheet, and according to the test vectors provided by manufacturers or compiled by oneself, IC testing machine can be used to test the DC characteristic parameters, functions of components, the limiting values of partial electric performance parameters and operating range, etc., for example:
·Logical IC
·Phonic IC
·Memory IC
·ROM data verification
·OTP program burning

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